New Chief Commercial Officer (CCO) and Principal Product Architect bring senior leadership acumen from Silicon Labs and NXP Semiconductors, respectively

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, today announced Dhiraj Sogani as Chief Commercial Officer (CCO) and Frank Leong as Principal Product Architect. In their new roles, Sogani and Leong will contribute organizational leadership and lead strategic initiatives enabling SPARK to maximize revenue generation and innovation for a new stage of company growth.

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Dhiraj Sogani, Chief Commercial Officer (left), and Frank Leong, Principal Product Architect (right), SPARK Microsystems

Global intelligence firm ABI Research forecasts next-generation ultra-wideband (UWB) to power 1.4 billion devices by 2030 as the ecosystem matures and applications diversify. Per ABI Research, UWB is one of the fastest-growing wireless connectivity technologies, with device shipments forecast to grow at a 21% compound annual growth rate (CAGR) between 2025 and 2030.

SPARK Microsystems’ LE-UWB™ is differentiated as the only UWB-based technology to service the full breadth of wireless connectivity applications – ranging, sensing and low-latency, high-throughput data communications. The performance and power efficiency advantages enabled with SPARK LE-UWB™ are unrivaled by traditional UWB, Bluetooth and Wi-Fi platforms.

“The market opportunity for SPARK LE-UWB™ connectivity is massive and SPARK is scaling to meet this opportunity, welcoming senior leaders with proven expertise and deep industry pedigree to the team,” said Fares Mubarak, CEO, SPARK Microsystems. “Talent is a key differentiator for SPARK. We invite the industry’s best and brightest to join us as we innovate the future of wireless connectivity.”

Dhiraj Sogani will lead SPARK’s sales, marketing and product management organizations as CCO. In his recent senior leadership role in Product and Business Marketing at Silicon Labs, Inc., Sogani had global responsibility for launching and managing high-impact wireless semiconductor product portfolios, generating hundreds of millions of dollars in revenue. He previously held worldwide responsibility for the Wireless Chip and Module Business at Redpine Signals (acquired by Silicon Labs in 2020). Sogani brings proven expertise in product strategy, go-to-market execution, ecosystem development and channel partnerships.

“The advent of mobile AI and AR devices invites a correspondingly major disruption in short-range wireless technology and SPARK is uniquely positioned to lead this transformation. The growth potential for SPARK at this pivotal market moment is exceptional and we’ll meet this moment with acumen, discipline and world-class customer engagement that accelerates the mainstream commercialization of LE-UWB,” commented Sogani.

As Principal Product Architect, Frank Leong will guide SPARK’s technical vision for LE-UWB™ technology. In his recent role as senior engineer and product manager, Leong oversaw NXP Semiconductors’ UWB product portfolio and helped cultivate RF product families earning more than $1B U.S. in revenue. In 2019, NXP honored Leong with a Master Inventor Award in recognition of his 35+ granted U.S. patents. He is an active technology evangelist engaged with standards bodies and a frequent contributor to industry conferences and publications.

“LE-UWB represents a major technological breakthrough, enabling transformative new applications and use cases for mobile connected devices. SPARK is uniquely positioned to unlock the full promise of UWB as a driving force within a broad ecosystem of industry innovators committed to collaboration and standardization. My mission is to architect and execute the SPARK LE-UWB technology roadmap in order to meet growing demand and challenges associated with new, disruptive applications,” commented Leong.

About SPARK Microsystems

SPARK Microsystems is building next-generation short-range wireless communication devices for consumer, industrial and medical applications. Leveraging patented LE-UWB™ technology, SPARK delivers ultra-low-power, high-speed wireless connectivity with unmatched interference robustness and exceptionally low latency. LE-UWB™ technology is ideally suited for wearables, peripherals, tags, sensors, and other IoT-connected devices that require reliable, high-performance data communication, as well as ranging and positioning capabilities. SPARK makes it possible to minimize and ultimately eliminate wires and batteries from a wide range of applications underserved by existing wireless technologies. For more information, please visit sparkmicro.com.

SPARK MICROSYSTEMS and LE‑UWB are trademarks or registered trademarks of SPARK Microsystems in Canada and/or other countries. All other trademarks are the property of their respective owners.

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The market opportunity for SPARK LE-UWB™ connectivity is massive and SPARK is scaling to meet this opportunity, welcoming senior leaders with proven expertise and deep industry pedigree.