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Amkor Technology to Present at Baird’s 2019 Consumer, Technology and Services Conference

Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in Baird’s 2019 Consumer, Technology and Services Conference on Tuesday, June 4, 2019. Amkor’s presentation will occur at 7:55 am Eastern Time (4:55 am Pacific Time) at the InterContinental New York Barclay, in New York, NY.

An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkor’s website.

About Amkor Technology, Inc.

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com.

Contacts:

Amkor Technology, Inc.
Vincent Keenan
Vice President, Investor Relations
480-786-7594
vincent.keenan@amkor.com

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